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3D White Light Interference Profilometer
BACK
Standards:
Applications:
Product Information:
Compact exterior design suitable for both laboratory and on-site applications.
Stage-controlled measurement with real-time display of measurement images, 3D results visualization, and cross-sectional selection and analysis.
The measurement and analysis software features an intuitive and user-friendly interface with powerful analysis capabilities.
Measurement Principle
White-light interferometric microscopy: combines a white-light source, non-coherent interferometry and high-resolution microscopic imaging to generate micro-scale 3D topography. Different objective magnifications enable sub-nanometer vertical resolution.
Microspectroscopy (optional): optional spectral module supports micro-area spectral analysis and thin-film thickness measurement.
Applicable Objects
Precision optical components, micro/nano-fabricated devices, metal machined parts and related samples.
Product Advantages
Nanometer-level vertical resolution for smooth surface analysis
Simple, accurate, fast and repeatable measurement
Can be integrated with confocal microscopic reflection spectroscopy
Product Functions
Non-contact 3D surface roughness measurement
Micro-scale 3D structure measurement
Microscopic reflection spectroscopy (optional)
One-click rapid measurement
Product Specifications
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Category |
Specification |
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Product Name |
3D White Light Interference Profilometer |
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Technical Specifications |
Measurement Mode: PSI / VSI / Bright Field (Full Mode) |
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Single Measurement Field of View: 500 × 350 μm (20× Objective) |
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Tilt Adjustment: ±12° (Manual) |
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Z-axis Adjustment: 120 mm Motorized + 75 mm Manual (Coarse/Fine Adjustment) |
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Z-axis Scanning Range: 0–10 mm |
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Vertical Repeatability: 0.2 nm (PSI Mode) |
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Step Height Measurement Error: <1% (VSI Mode) |
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Optical Resolution @550 nm: 0.69 μm (20× Objective) |
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Sample Reflectivity: 0.1%–100% |
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Measurement Time: <5 s (PSI Mode) |
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Software Functions: Laser-Assisted Fringe Positioning; Automatic Roughness and Height Analysis |
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Data Output: 2D Roughness Parameters, 3D Analysis, 3D Display, 2D Measurement |
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Hardware Configuration |
3D Measurement Microscope Main Unit |
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Optical Module |
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Interferometric Objective: Nikon CF PLAN DI 20× Mirau |
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Bright-Field Objectives (5×, 10×, 50×) |
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Enhanced Support Frame |
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Motorized XY Stage (50 × 50 mm Travel) |
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Air Isolation Platform (750 × 750 × 800 mm, Load Capacity: 200 kg) |
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Silent Oil-Free Air Compressor |
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Industrial Computer and Display |
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Standard Glass Block |
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Software |
PMS_calc Software |
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Embedded 3D Measurement Analysis Software V1.0 |
