Standards:

Applications:

Product Information:

The multifunctional thermal conductivity tester adopts the Transient Plane Source (TPS) method, and is mainly used to measure the thermal conductivity, thermal diffusivity, specific heat capacity, thermal effusivity, and thermal resistance of materials such as solids, powders, coatings, thin films, and anisotropic materials.This instrument is based on TPS technology and uses a Hot Disk sensor as the probe for thermal conductivity measurement.

Advantages of the Hot Disk Method

Direct measurement of heat transfer, significantly reducing testing time;

Not affected by contact thermal resistance as in steady-state methods;

No special sample preparation required—only relatively flat sample surfaces are needed.

Main Technical Specifications

Thermal Conductivity Range：0.0010 – 300 W/(m·K);Resolution：0.0001 W/(m·K)

Measurement Time：1 – 600 seconds

Accuracy：Relative error：≤ 3%;Repeatability error：≤ 3%

Temperature Range：Standard measurement：Room temperature;Optional configurations (at additional cost)：Room temperature ~ 150°C (with constant temperature chamber)，-40°C ~ 100°C (with high-low temperature chamber)

Sample Size Requirements：Solid bulk samples: Not less than 30 × 30 × 7.5 mm;If a single layer is insufficient, multiple layers can be stacked for testing;Sample surfaces should be relatively flat;Powder and gel materials: Can be tested by direct probe insertion

Reference Standards：ISO 22007-2008;GB/T 32064-2015 (Transient Plane Source method for thermal conductivity and diffusivity of building materials);DZ/T 0276.14-2015 (Geological and Mineral Industry Standard of China – Test methods for rock thermal conductivity);GB/T 11205-2009 (Determination of thermal conductivity of rubber – Transient hot wire method)

Operation：Easy to operate with fast testing speed. Simply place the probe between two sample pieces and obtain thermal conductivity results through simple software operation.

Power Supply：Voltage 220 V;Frequency 50 Hz;Power < 500 W

Communication Interface：USB interface

Probe Technical Specifications

Heating Material：Nickel

Operating Temperature：-50°C to 150°C

Maximum Power：20 W

Maximum Voltage：20 V

Maximum Current：1 A

Resistance：Approximately 10 Ω (refer to the value marked on the probe)

Nickel Wire Specifications：Thickness: 0.01 mm;Width: 0.35 ± 0.03 mm;Spacing: 0.35 ± 0.03 mm

Protective Layer Material：Polyimide film (Kapton);Single layer thickness： 0.06 mm

Probe Diameter：7.5 mm or 15 mm (optional)

Total Probe Thickness (including bonding layer)：0.07 ± 0.02 mm

Instrument Configuration

Main testing unit: 1 set

Test probe: 1 piece

Testing software: 1 set

Communication interface and data cable: 1 set

Sample fixture: 1 piece

Computer: 1 unit

Optional: Constant temperature device (available at additional cost)