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Home > Products > Category > Tunnel Oven > > Non-standard Tunnel Reflow Oven (Vacuum Reflow Oven)

Non-standard Tunnel Reflow Oven (Vacuum Reflow Oven)

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Non-standard Tunnel Reflow Oven (Vacuum Reflow Oven)

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Product Information:

The Non-standard Tunnel Reflow Oven (Vacuum Reflow Oven) is a customized continuous thermal processing system designed for high-precision soldering and heat treatment applications. It integrates vacuum technology with multi-zone heating and hot air circulation to ensure reliable solder reflow, reduced voids, and improved product quality. The system features a stainless steel mesh belt conveyor, stable transmission, and cleanroom-compatible design, making it suitable for advanced manufacturing environments.

Applications

This non-standard vacuum tunnel oven is widely used in industries requiring high reliability and precision:

Electronics: PCB, SMT reflow soldering, component curing

Semiconductor: chip packaging and bonding processes

New energy: battery module soldering and heat treatment

Automotive electronics: high-reliability soldering applications

Precision manufacturing: components requiring vacuum heat processing

Technical Parameters

Parameter Specification
Power Supply AC380V, 3 Phase, 50Hz
Total Length 6000 mm
Heating Zone Length 5000 mm
Temperature Range 40℃ – 350℃ (Typical ≤180℃)
Temperature Uniformity ±3℃ (excluding inlet/outlet)
Conveyor Speed 0.3 – 2.0 m/min (adjustable)
Typical Speed 0.8 m/min
Conveyor Type SUS stainless steel mesh belt / Teflon belt
Belt Width 1010 mm
Heating Method Medium-wave quartz heating tubes
Exhaust Volume Max. 10.0 m³/min
Exhaust Pipe ∮80 mm × 6
Temperature Control Accuracy ±0.3% FS
Vacuum Requirement Vacuuming within 10 seconds
Control System Siemens PLC + Touchscreen
Temperature Recording 6-point recorder (USB export)
Surface Temperature ≤45℃ (except specific areas)
Cleanliness Level Class 100

Features

Customized Design: Fully non-standard, tailored to specific process and product requirements

Vacuum Reflow Capability: Reduces solder voids and improves bonding reliability

High Temperature Stability: Multi-zone PID control ensures consistent thermal performance

Cleanroom Compatibility: Stainless steel structure and low-particle design meet Class 100 standards

Efficient Heating System: Quartz heating tubes enable rapid and uniform heating

Reliable Conveying: Smooth, stable transport without vibration, jamming, or product damage

Advanced Automation: Siemens PLC system with MES integration support

Comprehensive Safety Protection: Includes phase protection, overload protection, emergency stop, and over-temperature protection

Easy Maintenance: Motorized top cover for safe and convenient access

FAQ

1. What is the advantage of a vacuum reflow oven compared to a standard tunnel oven?

A vacuum reflow oven significantly reduces voids in solder joints, improving product reliability, especially for high-end electronics.

2. Can this equipment be customized?

Yes, it is a non-standard system that can be fully customized in size, temperature zones, vacuum level, and conveyor structure.

3. How is cleanliness ensured during operation?

The oven uses a fully welded stainless steel chamber, low-friction conveyor design, and dust removal devices to meet Class 100 cleanroom requirements.

4. Is it suitable for high-precision electronics manufacturing?

Yes, it is specifically designed for industries such as semiconductor and automotive electronics where precision and reliability are critical.

5. Does it support process monitoring and data traceability?

Yes, it includes multi-point temperature monitoring and USB data export, enabling full process traceability and quality control.

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