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Vacuum Reflow Oven
BACK
Standards:
Applications:
Product Information:
The vacuum reflow oven is a continuous thermal processing system designed for high-reliability soldering and precision heating under vacuum conditions. It combines infrared heating, forced hot air circulation, and rapid vacuum capability to reduce voids and ensure stable product quality. The equipment is suitable for cleanroom environments and high-end electronic manufacturing.
Applications
Reflow soldering for electronic components
Semiconductor and IC packaging
PCB assembly and hybrid circuits
Optical and LCD module processing
High-reliability applications requiring low void rates
Technical Specifications
| Parameter | Specification |
|---|---|
| Power Supply | AC380V, 3 Phase, 50Hz |
| Total Length | 6000 mm |
| Heating Zone Length | 5000 mm |
| Temperature Range | 40°C – 350°C (Typical ≤180°C) |
| Temperature Uniformity | ±3°C (excluding inlet/outlet) |
| Conveyor Speed | 0.3 – 2.0 m/min (adjustable) |
| Typical Speed | 0.8 m/min |
| Conveyor Type | SUS stainless steel mesh belt / PTFE belt |
| Belt Width | 1010 mm |
| Heating Method | Medium-wave quartz heaters |
| Exhaust Volume | Max. 10.0 m³/min |
| Exhaust Pipe | Ø80 mm × 6 |
| Exhaust Temperature | ≤150°C |
| Vacuum Performance | Vacuum achieved within 10 seconds |
| Temperature Control Accuracy | ±0.3% FS |
| Control System | Siemens PLC + Touchscreen |
| Temperature Monitoring | 6-point recorder with USB export |
| Surface Temperature | ≤45°C (except inlet/outlet & exhaust areas) |
| Cleanliness Level | Class 100 |
Features
Vacuum Reflow Technology: Effectively reduces solder voids and improves joint reliability
High-Temperature Capability: Supports processes up to 350°C
Uniform Heating System: Top-down hot air circulation ensures consistent temperature distribution
Fast Heating Response: Medium-wave quartz heaters enable rapid heating and curing
Cleanroom Design: Fully welded stainless steel chamber minimizes particle generation
Stable Conveyor System: Roller-supported mesh belt ensures smooth, damage-free transport
Precision Temperature Control: OMRON PID controller with SSR output ensures high accuracy
Advanced Automation: Siemens PLC and touchscreen support MES integration
Real-time Monitoring: Multi-point temperature recording with USB data export
Comprehensive Safety Protection: Includes phase sequence protection, overload protection, emergency stop, and over-temperature protection
FAQ
1. What is the main advantage of a vacuum reflow oven?
It reduces voids in solder joints by removing trapped gases, improving product reliability and consistency.
2. What industries typically use this equipment?
Electronics manufacturing, semiconductor packaging, PCB assembly, and optical module production.
3. How is temperature controlled accurately?
Through a PID controller combined with SSR output and multi-point temperature monitoring.
4. Can it operate in cleanroom environments?
Yes, it meets Class 100 cleanliness standards with low particle generation design.
5. Is the system suitable for automated production lines?
Yes, it supports PLC control and MES system integration for full automation and traceability.
