Standards:

Applications:

Product Information:

The Clean Oxygen-Free Oven G-10S is designed for high-precision baking processes requiring a clean and low-oxygen atmosphere. It adopts hot air circulation heating and a dual-door single-chamber structure to provide stable temperature control and uniform heat distribution.The oven is widely used in PCB, TP, LCD, electronic components, and silicone industries for material aging, silver paste curing, ink drying, and other thermal processing applications. Nitrogen filling can reduce oxygen concentration to 100 ppm, helping prevent oxidation during heat treatment. Customized solutions are available according to customer process requirements.

Applications

The Clean Oxygen-Free Oven G-10S is suitable for:

PCB baking and thermal curing

TP and LCD module processing

Electronic component aging treatment

Silver paste curing

Conductive adhesive curing

Ink drying processes

Silicone material heat treatment

Precision parts requiring low-oxygen baking environments

Technical Parameters

Features

Low Oxygen Baking Environment

Supports adjustable nitrogen filling to reduce oxygen concentration to 100 ppm and prevent material oxidation.

Uniform Hot Air Circulation

Double-side horizontal airflow design ensures balanced air distribution and stable temperature performance.

Large Capacity Single Chamber

The W1000 × D700 × H1500 mm chamber provides sufficient working space for batch processing.

Cleanroom Compatible Structure

SUS304 stainless steel chamber and airflow channels help reduce contamination and particle generation.

Energy-Efficient Insulation Design

Six-side insulation structure with 150 mm insulation material reduces heat loss and improves energy efficiency.

Precise Temperature Control

Digital PID temperature controller with SSR output provides accurate and stable temperature regulation.

Reliable Air Circulation System

High-temperature long-shaft motor ensures continuous and stable airflow operation.

Convenient Operation Design

Double doors with heat-resistant silicone sealing provide easy loading and effective chamber sealing.

Comprehensive Safety Protection

Equipped with over-temperature protection, motor overload protection, heater overload protection, circuit protection, and non-fuse breaker.

Customizable Configuration

Chamber size, nitrogen control system, airflow structure, and process parameters can be customized according to production requirements.

FAQ

1. What is a clean oxygen-free oven used for?

A clean oxygen-free oven provides a low-oxygen and low-contamination heating environment, mainly used for processes where material oxidation must be controlled.

2. What industries commonly use the G-10S oven?

It is widely used in PCB, TP, LCD, electronic components, silicone products, and precision manufacturing industries.

3. Why does the oven require nitrogen filling?

Nitrogen reduces oxygen concentration inside the chamber, preventing oxidation and improving product quality during high-temperature processing.

4. How does the oven G-10S maintain temperature uniformity?

The oven uses double-side horizontal airflow circulation combined with PID temperature control to achieve stable temperature distribution.

5. Can the G-10S be customized for different production processes?

Yes. Chamber dimensions, nitrogen control, heating specifications, and airflow design can be customized according to customer requirements.